December 20, 2011
the this year, has been calm for us with thoughts of Faye Wong, debut the show, and recently even had to wear an English a four of the people do not know vest in in the microblogging someone guest of poverty, people recognize the Word not only for Mensao men, but also for women.This year, not only casually called Viagra, can also be are able to producedthis year, Oreo, banana, 皮蛋瘦肉粥, mustard greens and other findsthat is a rice bowl Jiaochen body like her is like Yuhuan / p>
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this year Oscars received a Korean Lao Jin classes, but soon the talk of the town just next door to dry up, because even a little gold on the microblogging talk of the town was concerned about the talk of the town refused.
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this year, market regulation, the more stressed the more empty, straight up house prices, people distraught Liushenwuzhu.
this year, Chile is not only an earthquake also occurred in mine, 33 miners in the mine spent two or three months did not die, not only to prove the earth can be to do a card and prove that China huge market potential chrysanthemum.
this year, Beijing blocked traffic days, man that car on the official card Yaohao estimated fun.
2010 over over, having left in 2010 as the morning kindergarten boy, took to drive to work reluctant to part time mother clothes as .2011 years???
year Jiangxi a nail house with the most frustrating way to end his life, his death, authorities can not prove that the brutal and shameless, only a little on that gasoline.
this year , China high prices from a lot of people have not had time to consider whether
this year, failed plastic shell over the Queen, not only did not face, and even lives are gone, the Northeast often say – and I to death you are not mean.
this year, strong demolition, Nails two most used word. who is and who do not understand, I knew no one would dare Zhongnanhai removed.
this year, Chinese archaeologists discovered the tomb of Cao Cao two skulls, one of Cao Cao, a kid of Cao Cao. professors, scholars, a fight to a bustling.
this year , China has developed a new desert called the extent of their favorite will soon become the nation totem.
this year, beginning with the breast milk of domestic functions.
this year , it is fortunate that the vast majority of Chinese people also a strong alive. a strong sense of social responsibility many times beating our hearts.
This year, the last few days, in Money Games in cooperation with the village head, relentless advance in the history of wheels on the road left a deep imprint.
this year cheap Nike Shox R2 Shoes, China is still holding its annual Spring Festival, but more and more like sketches Zhao Feng Xiaogang movie, Liu Qian magic more and more like drama, dubious they can only let the Little Tigers time really flies! people.
this year, China held two national day of mourning, the majority of fellow citizens in mourning but also profound experience to be held as long as a day of mourning, we must stop the server online.
This year, like to watch heavy local accent was shut out.
year strong injection of a text, the text do not know how many are waiting for strong injection.
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July 30, 2010
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September 30, 2011
Man of the Match: Billy Holland (Foxhole). Such as? Take yesterday. The xperts were sure that the official figures would show the economy grew by just 0.4pc between July and September. in fact, gross domestic product grew by 0.8pc – less than the 1.2pc Pearl Beads seen in the previous three months but double the average forecast.Applicable Pearl Beads Criteria and Related Research: SAN FRANCISCO – Biomagnetics Diagnostics Corp. , (PINK SHEETS: BMGP) a developer of revolutionary diagnostic systems and other innovative technologies, today announced that Dr. Harshini Mukundan, Scientist at Los Alamos National Laboratories (the the holmium muddy ANL holmium? will be presenting a technical Ho Wei ebinar holmium? or web-based seminar, to scientific attendees Pearl Beads on the Integrated Optical Biosensor Development (IOBS) technology developed at LANL. Those affiliated with BMGP are welcome to attend.
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August 22, 2011
reproduced from friends network user at 00:03 on March 5, 2010 the read (loading. ..) Comments (0) Category: the Personal Diary ] (R ) – Qzone log
Back to logs list 1, those who know me, that I am lazy, I do not know me, that I want anything else. (Book of Songs, Wang Feng from millet )
2, people without instrument, how to die. (Book style with mouse)
3, speaker of innocence, their fates warning. (Book of Songs, Great Preface )
4, stone hills, can learn. (Book of Songs Xiaoya Heming)
5, vote for me to peach, quoted by Lee. (Book of Songs, Daya suppression)
6, days of sin, still can be violated, regret, can not live. (Book)
7, full-stroke loss, to benefit him. ( Book of Yu-mo)
8, such as from a good board, such as the collapse from evil. (Mandarin)
9, unjust is doomed to destruction. ( Tso)
10, prepared and thought is well prepared, be prepared. (Tso)
11, who err too? Over and can change the hell. (Tso) < br />
12, Appreciating a wise, knowing those out. (I)
13, the letter made no beauty, kind words do not believe. (I)
< br /> 14, Misfortune blessing of the Forest, Fu Xi disaster of the V. (I)
15, encircle the wood, was born in Haomo; nine of the units, from the tired soil; a thousand miles begins with one step. (I)
16, sensitive and eager to learn, help in the field. (The Analects of Confucius Gongye Chang)
17, Do unto others, do not impose on others. (The Analects of Confucius Yen-Yuan)
18, we must first sharpen his tools. (Analects of Duke Ling of Wei)
19, gentleman expansive, long sad villain. (Analects of Confucius described)
20, Winter, and then withered after the known pine also. (Analects Zi Han)
21, Learning without thought is labor lost, thought without learning is perilous. (The Analects of Confucius as the government)
22, were perplexed to know, do not worry benevolent, brave fear. (Analects Zi Han)
23, people who without it? Over and can change the hell. (The Analects of Confucius)
24, known as know, I do not know as I do not know, that is knowledge. (The Analects of Confucius as the government)
25, who know better than the good, good of the person not the music. (Analects of Confucius Yong) < br />
26, the body is not to make the trip; its body is not correct, although that is not from. (Analects Zi)
27, three lines, must be my teacher: choosing the good from it, instead of its poor. (Analects of Confucius described)
28, road trip, Things. (Book of Rites, Li Yun)
29, forewarned is forearmed, without prejudging the waste. (Book of Mean)
30, learn and then know enough to teach and to know the storm. (Book of Rites school record)
31, Jade is not cut, not a device; people do not learn, do not know. (Book of Rites school record)
32, road is long Come, happiness and earth. (Qu Yuan Lament)
33, a short foot, abercrombie
February 9, 2011
– Wet Seal two years of troubles came to a head Tuesday when the company announced it is closing 150 of its Wet Seal stores and laying off 2,000 employees. The company, based in Foothill Ranch, was once one of the largest teen retailers in the country. But it has not been able to turn around its business since its Breitling Bentley Quartz Chronograph BT-53-winning streak cooled in 2002. Since then, top executives have been shown the door, a former fashion wunderkid failed to lure customers back with “granny chic” styles, and the company has hemorrhaged money. In the third quarter ended Oct. 30, the company lost nearly $ 25 million. In the key holiday selling month of November, sales at stores open more than a year, a key measure of a retailer health, fell 19 percent. The company stock price has plummeted 79 percent this year, Breitling Breitling Bentley Quartz Chronograph BT-49 a low of 74 cents in August. “It sad,” said Ilse Metcheck, executive director of the California Fashion Institute in Los Angeles. “I hate to see this happen to a California company.” Wet Seal has not said which stores will close because it is still negotiating with landlords, spokeswoman Helen Rotherham said. The vast majority of layoffs will be at the store level, with a small number at corporate headquarters, she said. There are 58 Wet Seal stores in California and seven in Orange County. After the 150 stores close by the end of February, the company will have approximately 313 Wet Seal locations and 96 Arden B. stores. Arden B., which has been hugely successful, caters to a somewhat Breitling Chrono-Matic Automatic BT-62, more affluent shopper than the teen-oriented Wet Seal. Stock analyst Katherine Galligan at Aperion Group, an investment firm in Dallas, believes the company would be better off converting Wet Seal stores to Arden B. locations. She has said Wet Seal has squandered its brand equity with its fashion misses. The announcement of store closures comes on the heels of Wet Seal accepting a Breitling Chrono-Matic BT-46 deal with outside investors for a cash infusion of up to $ 56 million to stave off bankruptcy. Shareholders will vote on that proposal Jan. 10. In regulatory filings related to the proposal, the company had said it would be closing a significant number of stores. The company also said its new merchandising strategy will focus on price – a strategy many fashion experts believe is ill-advised. Wet Seal biggest and most successful competitor, Forever 21, had dominated the “fast-fashion,” low-price game. Unlike Wet Seal stores, Forever 21 locations are usually packed with shoppers, and the bright yellow Forever 21 bags are often on the arms of teens at local malls. To successfully focus on price, a retailer needs great merchandisers who make the right fashion decisions – something Wet Seal has struggled with for two years. The fashion has to be right all the time because with the price already low, it hard to mark down goods significantly to move inventory without eroding profits, Metcheck said. And while closing underperforming stores will help the bottom line, the company will still need to revamp the remaining stores to attract fickle teen shoppers, Metcheck said. That will be a challenge because the company may be having difficulties attracting top Breitling Chrono-Matic BT-61 and, with its financial struggles, top manufacturers probably won ship to them, fearing they won get paid, Metcheck said. “If they can lick the merchandising mix and the presentation in the stores then they can come back, “she said.” The question is, ho is in charge of the ship? “That would be new Chief Executive Joel Waller, who starts Feb. 1. The former chairman and chief executive of Wilsons Leather replaces Peter Whitford who resigned in November after his promised back-to-school turnaround bombed. Whitford replaced longtime Chief Executive Kathy Bronstein, who was fired in February 2003.
July 16, 2010
ORACLE learning 2010-07-16 16:32:58 16 0 comments: an information medium and small subscription oradebug
This is previously collected, forget from where did get to share the
1, to obtain help
SQL> oradebug help
2, indicating the /> Dumping of
HELP command
The ORADEBUG HELP command lists the commands available within ORADEBUG
These vary by release and platform. Commands appearing in this help do not necessarily work for the release / platform on which the database is running
For example in Oracle 9.2.0.1 (Windows 2000) the command
ORADEBUG HELP
SETMYPID command
Before using ORADEBUG commands, a process must be selected. Depending on the commands to be issued, this can either be the current process or another process
Once a process has been selected, this will be used as the ORADEBUG process until another process is selected
The SETMYPID command selects the current process as the ORADEBUG process
For example
ORADEBUG SETMYPID
ORADEBUG SETMYPID can be used to select the current process to run systemwide commands such as dumps
Do not use ORADEBUG SETMYPID if you intend to use the ORADEBUG SUSPEND command
SETORAPID command
Before using ORADEBUG commands, a process must be selected. Depending on the commands to be issued, this can either be the current process or another process
Once a process has been selected, this will be used as the ORADEBUG process until another process is selected
The SETORAPID command selects another process using the Oracle PID as the ORADEBUG process
The syntax is
ORADEBUG SETORAPID pid
where pid is the Oracle process ID of the target process For example
ORADEBUG SETORAPID 9
The Oracle process id for a process can be found in V $ PROCESS.PID
To obtain the Oracle process ID for a foreground process use
< br /> SELECT pid FROM v $ process WHERE addr = (SELECT paddr FROM v $ session WHERE sid = DBMS_SUPPORT.MYSID);
Alternatively, if the DBMS_SUPPORT package is not available use
< br /> SELECT pid FROM v $ process WHERE addr = (SELECT paddr FROM v $ session WHERE sid = (SELECT sid FROM v $ mystat WHERE ROWNUM = 1));
To obtain the process ID for a background process eg SMON use
SELECT pid FROM v $ process WHERE addr = (SELECT paddr FROM v $ bgprocess WHERE name = MON ;
To obtain the process ID for a dispatcher process eg D000 use
SELECT pid FROM v $ process WHERE addr = (SELECT paddr FROM v $ dispatcher WHERE name = 000 ;
To obtain the process ID for a shared server process eg S000 use
SELECT pid FROM v $ process WHERE addr = (SELECT paddr FROM v $ shared_server WHERE name = 000 ;
To obtain the process ID for a job queue process eg job 21 use
SELECT pid FROM v $ process WHERE addr = (SELECT paddr FROM v $ session WHERE sid = (SELECT sid FROM dba_jobs_running WHERE job = 21));
To obtain the process ID for a parallel execution slave eg P000 use
SELECT pid FROM v $ px_process WHERE server_name = 000
SETOSPID command
Before using ORADEBUG commands, a process must be selected. Depending on the commands to be issued, this can either be the current process or another process
Once a process has been selected, this will be used as the ORADEBUG process until another process is selected
The SETOSPID command selects the another process using the operating system PID as the ORADEBUG process
< br /> The syntax is
ORADEBUG SETOSPID pid
where pid is the operating system process ID of the target process For example
ORADEBUG SETOSPID 34345
The operating system process ID is the PID on Unix systems and the thread number on Windows NT/2000 systems
On Unix the PID of interest may have been identified using a top or ps command
TRACEFILE_NAME command
This command prints the name of the current trace file eg
ORADEBUG TRACEFILE_NAME
For example
/ export/home/admin/SS92003/udump/ss92003_ora_14917. trc
This command does not work on Windows 2000 (Oracle 9.2)
UNLIMIT command
In Oracle 8.1.5 and below the maximum size of the trace file is restricted by default. This means that large dumps (LIBRARY_CACHE, BUFFERS) may fail.
To remove the limitation on the size of the trace file use
ORADEBUG UNLIMIT
In Oracle 8.1.6 and above the maximum size of the trace file defaults to UNLIMITED < br />
FLUSH command
To flush the current contents of the trace buffer to the trace file use
ORADEBUG FLUSH
CLOSE_TRACE command
To close the current trace file use
ORADEBUG CLOSE_TRACE
SUSPEND command
This command suspends the current process
First select a process using SETORAPID or SETOSPID
Do not use SETMYPID as the current ORADEBUG process will hang and cannot be resumed even from another ORADEBUG process
For example the command
ORADEBUG SUSPEND
suspends the current process
The command
ORADEBUG RESUME
resumes the current process
While the process is suspended ORADEBUG can be used to take dumps of the current process state eg global area, heap, subheaps etc.
This example demonstrates how to take a heap dump during a large (sorting) query
This example requires two sessions, session 1 logged on SYS AS SYSDBA and session 2 which executes the query. In session 2 identify the PID using
SELECT pid FROM v $ process WHERE addr IN (SELECT paddr FROM v $ session WHERE sid = dbms_support.mysid);
In this example the PID was 12
In session 1 set the Oracle PID using
ORADEBUG SETORAPID 12
In session 2 start the query
SELECT … FROM t1 ORDER BY ….
In session 1 suspend session 2
ORADEBUG SUSPEND
The query in session 2 will be suspended
In session 1 run the heap dump
ORADEBUG DUMP HEAPDUMP 1
The heapdump will show the memory structures allocated for the sort. At this point further dumps eg subheap dumps can be taken.
In session 1 resume session 2
ORADEBUG RESUME
The query in session 2 will resume execution
RESUME command
This command resumes the current process
First select a process using SETORAPID or SETOSPID
Do not use SETMYPID as the current ORADEBUG process will hang and cannot be resumed even from another ORADEBUG process
For example the command
ORADEBUG SUSPEND
suspends the current process
The command
ORADEBUG RESUME
resumes the current process
While the process is suspended ORADEBUG can be used to take dumps of the current process state eg global area, heap, subheaps etc.
See SUSPEND for an example of use of the SUSPEND and RESUME commands
WAKEUP command
To wake up a process use
ORADEBUG WAKEUP pid
For example to wake up SMON, first obtain the PID using
< br /> SELECT pid FROM v $ process WHERE addr = (SELECT paddr FROM v $ bgprocess WHERE name = MON ;
If the PID is 6 then send a wakeup call using
ORADEBUG WAKEUP 6
DUMPLIST command
To list the dumps available in ORADEBUG use
ORADEBUG DUMPLIST pid
For example in Oracle 9.2 (Windows 2000) this command returns the following
Dump Name
EVENTS
TRACE_BUFFER_ON
TRACE_BUFFER_OFF
HANGANALYZE
LATCHES
PROCESSSTATE
SYSTEMSTATE
INSTANTIATIONSTATE
REFRESH_OS_STATS
CROSSIC
CONTEXTAREA
HEAPDUMP
HEAPDUMP_ADDR
POKE_ADDRESS
POKE_LENGTH
POKE_VALUE
POKE_VALUE0
GLOBAL_AREA
MEMORY_LOG
REALFREEDUMP
ERRORSTACK
HANGANALYZE_PROC
TEST_STACK_DUMP
BG_MESSAGES
ENQUEUES
SIMULATE_EOV
KSFQP_LIMIT
KSKDUMPTRACE
DBSCHEDULER
GRANULELIST
GRANULELISTCHK
SCOREBOARD
GES_STATE
ADJUST_SCN
NEXT_SCN_WRAP
CONTROLF
FULL_DUMPS
BUFFERS
RECOVERY
SET_TSN_P1
BUFFER
< br /> PIN_BUFFER
BC_SANITY_CHECK
FLUSH_CACHE
LOGHIST
ARCHIVE_ERROR
REDOHDR < br />
LOGERROR
OPEN_FILES
DATA_ERR_ON
DATA_ERR_OFF
BLK0_FMTCHG
TR_SET_BLOCK
TR_SET_ALL_BLOCKS
TR_SET_SIDE
TR_CRASH_AFTER_WRITE
TR_READ_ONE_SIDE
TR_CORRUPT_ONE_SIDE
TR_RESET_NORMAL
TEST_DB_ROBUSTNESS
LOCKS
GC_ELEMENTS
FILE_HDRS
KRB_CORRUPT_INTERVAL
KRB_CORRUPT_SIZE
KRB_PIECE_FAIL
KRB_OPTIONS
KRB_SIMULATE_NODE_AFFINITY
KRB_TRACE
KRB_BSET_DAYS
DROP_SEGMENTS
TREEDUMP
LONGF_CREATE
ROW_CACHE
LIBRARY_CACHE
SHARED_SERVER_STATE
KXFPCLEARSTATS
KXFPDUMPTRACE
KXFPBLATCHTEST
KXFXSLAVESTATE
KXFXCURSORSTATE
WORKAREATAB_DUMP
OBJECT_CACHE
SAVEPOINTS
OLAP_DUMP
DUMP command
To perform a dump use
ORADEBUG DUMP dumpname level
For example for a level 4 dump of the library cache use
ORADEBUG SETMYPID ORADEBUG DUMP LIBRARY_CACHE 4
EVENT command
To set an event in a process use
ORADEBUG EVENT event TRACE NAME CONTEXT FOREVER, LEVEL level
For example to set event 10046, level 12 in Oracle process 8 use
ORADEBUG SETORAPID 8 ORADEBUG EVENT 10046 TRACE NAME CONTEXT FOREVER, LEVEL 12
SESSION_EVENT command
To set an event in a session use
ORADEBUG SESSION_EVENT event TRACE NAME CONTEXT FOREVER, LEVEL level
For example
ORADEBUG SESSION_EVENT 10046 TRACE NAME CONTEXT FOREVER, LEVEL 12
DUMPSGA
To dump the fixed SGA use
ORADEBUG DUMPSGA
DUMPVAR
To dump an SGA variable use
ORADEBUG DUMPVAR SGA variable_name
eg
ORADEBUG DUMPVAR SGA kcbnhb
which returns the number of hash buckets in the buffer cache
The names of SGA variables can be found in X $ KSMFSV.KSMFSNAM. Variables in this view are suffixed with an underscore eg
kcbnhb_
PEEK
To peek memory locations use
ORADEBUG PEEK address length
where address can be decimal or hexadecimal and length is in bytes
For example
ORADEBUG PEEK 0×20005F0C 12
< br /> returns 12 bytes starting at location 0×20005f0c
POKE
To poke memory locations use
ORADEBUG POKE address length value
< br /> where address and value can be decimal or hexadecimal and length is in bytes
For Example
ORADEBUG POKE 0×20005F0C 4 0×46495845 ORADEBUG POKE 0×20005F10 4 0×44205349 ORADEBUG POKE 0×20005F14 2 0×5A45
WARNING Do not use the POKE command on a production system
IPC
To dump information about operating system shared memory and semaphores configuration use the command
ORADEBUG IPC
This command does not work on Windows NT or Windows 2000 (Oracle 9.2)
On Solaris, similar information can be obtained using the operating system command
ipcs-b
Dumping the SGA
In some versions it is possible to dump the entire SGA to a file
Freeze the instance using
ORADEBUG FFBEGIN
Dump the SGA to a file using
ORADEBUG SGATOFILE directory
Unfreeze the instance using
ORADEBUG FFRESUMEINST
This works in Oracle 9.0.1 and 9.2.0 on Solaris, but fails in both versions in Windows 2000
Oracle the Documents:
================================= =======
Using ORADEBUG Utility
ORADEBUG utility is a debugging tool that sends debug commands through SQL * Plus to an Oracle process. It is primarily for use by developers and Oracle Support Services personnel. Use this utility only when instructed to do so by Oracle Support Services. You must have database administrator privileges to use ORADEBUG utility.
To start ORADEBUG utility:
Start the SQL * Plus from the command prompt:
C:> sqlplus / NOLOG
Connect to the Oracle9i database as SYSDBA:
SQL> CONNECT / AS SYSDBA
Enter the following at the SQL * Plus prompt:
SQL> ORADEBUG
ORADEBUG utility runs and prompts you for parameters. To obtain a list of these parameters, enter the following at the SQL * Plus prompt:
SQL> ORADEBUG HELP
Output from most debug commands is written to a trace file. Trace files are created in the directory specified by initialization parameters BACKGROUND_DUMP_DEST and USER_DUMP_DEST. By default, these parameters are set to ORACLE_BASEADMINdb_namebdump and ORACLE_BASEADMINdb_nameudump, respectively. To find the location of your trace file, enter the following at the SQL * Plus prompt:
SQL> ORADEBUG TRACEFILE_NAME
If output from a debug command produces more than one line of output, then the result is sent to a trace file, and a message indicating that the command has completed is relayed to SQL * Plus. If output from a debug command produces only one line of output, then the output is relayed directly to SQL * Plus.
——– ————————————————– ———————-
Note:
There is currently a limitation when using ORADEBUG utility to. If you attempt to debug a thread that is blocking on I / O, ORADEBUG can cause SQL * Plus to hang until that I / O completes.
———— ————————————————– ——————
the Invoke function with the arguments
June 24, 2011
Fishing on the banks was forever changed when the first fishing pier-author Jennette , Pier-was opened in Nags Head, back in 1939.
On May 22 , 2009, Governor Beverly Perdue led a gathering of legislators, local officials, and Aquarium leaders for a “sand-breaking” on the site of the new $ 25 million Jennette Pier, seventy years to the day from the first construction.
Thousands of people have visited the pier each day and night since it opened May 21, 2011. Jennette also features a public beach access with parking and bathhouse. With its 1,000-foot long fishing platform, 16,000-square foot pier house and numerous educational opportunities, this state-owned and operated facility celebrates Fishing, Families and Fun! A 40-pound plus cobia was landed on a recent Saturday afternoon by Virginia Beach angler Bryan “Dip Net” White. Families have flocked to the pier to try their luck or simply to view the varied exhibits in the pier house where refreshments, tackle and gifts are also available. The all-new Jennette Pier in Nags Head opens 24/7.
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service Master of Engineering Master of Applied Statistics Master of Management Master 1 GB / T 1772-1979 electronic components failure rate in 2012 01 months test methods Determination of failure rate of electronic elements and components
GB / T 2036-1994 printed circuit terminology Terms for printed circuits.
3 GB / T 2413-1980 piezoelectric ceramic material bulk density measurement methods Piezoelectric ceramic materials – Measuring methods for determination of volume density
4 GB / T 2470-1995 electronic devices with a fixed resistor, fixed capacitors for naming the Type designation is system for The fixed resistors and fixed capacitors for use in electronic equipment
5 GB / T 2471-1995 resistors and capacitors of preferred numbers of Preferred number series for resistors and capacitors
6 GB / T 2472-1981 electronic devices with a fixed capacitor voltage series fixed capacitors for electronic equipments – Working voltage series
7 GB / T 2473-1981 electronic equipment Dimensions series of rectangular metal case capacitors Capacitors with rectangular metal enclosure for electronic equipments – Outline dimensions series
8 GB / T 2474-1981 electronic devices with circular metal case capacitors Dimension Series Capacitors with disc metal enclosure for electronic equipments – the Outline dimensions series
9 GB / T 2658 -1995 AC miniature blowing. small AC wind machine technical conditions, general specification Fixed capacitors for
10 GB / T 2693-1990 Electronic Equipment Part 1: Generic specification (for certification to use) the Fixed capacitors for use in electronic equipment-Part 1: Generic specification
11 GB / T 2775-1993 hand control electronic components of the shaft end dimensions Dimensions has the of spendle ends for manually operated electronic components
12 GB / T 3351-1982 man-made quartz crystals of the type designation Designations for synthetic quartz was crystals
13 GB / T 3388-1982 piezoelectric ceramic material model naming Designations for types of piezoelectric ceramics
14 GB / T 3389.3-1982 piezoelectric ceramic materials testing methods Curie temperature (Tc) test Test methods for the properties of piezoelectric ceramics – Test for the Curie temperature of Tc
15 GB / performance test method T 3389.4-1982 piezoelectric ceramic cylinder longitudinal length of the stretching vibration mode Test methods for the properties of piezoelectric ceramics – Longitudinal length to the extension Mechanics Download Adobe Reader mode for rod
16 GB / T 3389.7-1986 strong-field dielectric properties of the piezoelectric ceramic material performance test method test Test methods for the properties of piezoelectric ceramics – Test for dielectric properties in high electric field
17 GB / T 3389.8-1986 piezoelectric ceramic Test methods for properties testing of the pyroelectric coefficient Test methods for the properties of piezoelectric ceramics – Test for the pyroelectric coefficient
18 GB / T 3664-1986 capacitor nonlinear measurement method Method of measurement of non-linearity in capacitors
19 GB / T 3788-1995 vacuum capacitors General technical conditions of the General specification for vacuuming capacitors
20 GB / T 4071-1983 light phosphor test method Measuring method for the phosphors excited by light
21 GB / T 4072-1983 of the cathode-ray induced phosphor test methods Measuring method of the phosphors excited by cathod rays
22 GB / T for radio – radio frequency cable corona test methods Methods, Test method of the corona for the radio-frequency cables
23 GB / T 4098.2-1983 RF cable capacitance and capacitance unbalance measuring method of measurement of capacitance and capacitance unbalance for the radio-freguency cables
24 GB / T 4098.3-1983 RF cable characteristic impedance measurement method Methods, of measurement of the characteristic impedance. for radio-frequency cables
25 GB / for radio – radio frequency cable attenuation constant measurement method Methods, method of measurement of the attenuation constant stability test methods for radio-frequency cables
26 GB / T for radio – radio frequency cable capacitance Test of capacitance stability for the radio -frequency cables
27 GB / T 4098.6-1983 RF cable attenuation stability test method Test method of attenuation stability for radio-frequency cables
28 GB / T 4098.7-1983 RF Cable High Temperature Test Method Test method of high-temperature Test method of a low-temperature for radio-frequency cables for radio-frequency cables
29 GB / T-4098.8-1983 RF cable Low temperature test method
30 active GB / T 4098.9-1983 RF cable test methods Test Test method of flow stability test methods for radio-frequency cables
31 GB / T for radio – radio frequency cable size method of dimensional stability for the radio-frequency cables
32 GB / T 4165-1984 electronic devices use a variable capacitor guide Guide to the use of variable capacitors in electronic equipment
33 GB / T 4166-1984 electronic devices with variable capacitors test methods Methods, of test, of the variable capacitors in electronic equipment
34 GB / T 4210-1984 electronic devices with mechanical and electrical components noun terms Terms of electromechanical components for electronic equipment
35 GB / T 4475-1995 sensitive components of terms Terms of sensor
36 GB / T 4588.1-1996 metallized hole single-sided printed circuit board sub-specification Sectional specification: single and a double sided printed boards with plain holes
37 GB / T 4588.2-1996 metallized hole single-sided printed boards Sectional specification: single and a double sided printed boards with plated-through holes
38 GB / T-4588.3-1988 printed circuit board design and use of the Design and use of printed boards
39 GB of / T 4588.4- 1996 multi-layer printed boards Seetional spocification – Multilayer printed boards
40 GB / T 4588.10-1995 printed boards – Part 10: connection runs through Rigid-flex double-sided printed circuit board specifications Printed boards – Part 10: Specification for flex-rigid double-sided printed boards with through connections
41 GB / T 4596-1984 electronic equipment E-cores for the three-phase transformers with three – phase transformers to make edge resistance test method for use in electronic equipment
42 GB / T for printed printed circuit board surface Test method of the su *** ce insulation resistance for printed boards
43 GB / T 4677.2-1984 printed circuit board through holes coating thickness testing method of micro-resistance method Micro-resistance test method of plating thickness of platedthrough holes for printed boards
44 GB / T 4677.3-1984 India system board, pull strength test methods Test methods of pull strength. for printed boards
45 GB / T 4677.4-1984 printed circuit board peel strength test methods Test methods for printed boards
of peel strength.
46 GB / T 4677.5-1984 printed circuit board warpage test methods Test methods for printed boards
47 GB / T 4677.6-1984 metal and oxidation of platness cover thickness test methods section Metallographic the Test methods for thickness of the coating of metal and oxide, by microscopical examination of cross-section
48 GB / T by adhesive type for printed circuit board coating adhesion test method tape method Test method of plating adhesion by adhesive. type for printed boards
49 GB / T 4677.8-1984 printed circuit board plating coating thickness testing method to β reverse scattering method Test method of plating and coating thickness by beta backscattering for printed boards
50 GB / T 4677.9-1984 printed circuit board plating porosity electrical test method of The electrographic test, method of plating porosity for printed boards
51 GB / T 4677.10-1984 India The system board solderability test method Test method of solderability for printed boards
52 GB / T 4677.11-1984 printed circuit board thermal shock test methods Test methods of the thermal shock for printed boards
< br /> 53 GB / T for printed printed circuit board interconnect resistance test method Test method of interconnection resistance for printed boards
54 GB / T 4677.13-1988 printed circuit board through holes resistance changes thermal cycling test method Test method of change in resistance of the plated-through holes – Thermal cycling for printed boards
55 GB / T 4677.14-1988 printed circuit board steam – oxygen accelerated aging test method Test method of of steam / oxygen accelerated aging of printed board
56 GB / T 4677.15-1988 printed circuit board to make the edge of the coating solvent and flux resistance Test Method Test method for solvent and flux – resistance of insulating coating on printed boards
57 GB / T Common test methods for printed printed circuit board General examination method for printed boards
58 GB / T 4677.17-1988 of multilayer printed inner do insulation resistance test method Test method for insulation resistance within the layers, inner of using multilayer printed boards
59 GB / T 4677.18-1988 multi-layer printed circuit board layer to make edge resistance test method Test method for insulation resistance between the layers of multilayer printed boards
60 GB / T 4677.19-1988 printed circuit board integrity test methods Test method for electrical integrity of printed boards
61 GB / T 4677.20-1988 friction law of the printed circuit board plating adhesion test methods Test method for plating adhesion of printed boards – Burnishing 62 GB / T 4677.21-1988 printed circuit board coating porosity test gas exposure method Test method for plating porosity of printed boards – The gas exposure method
63 GB / T 4677.22-1988 printed circuit board surface ionic contamination test method Test method for su *** ce ionic contamination of printedboards
64 GB / T flammability of printed boards test method Test method for flammability of printed boards
65 GB / T 4721-1992 printed circuit with the general rules, copper clad laminates General the rules for the copper-clad laminated sheets, for printed circuits.
66 GB / T 4722-1992 printed circuit use copper clad laminate test methods Test methods for copper-clad laminated sheets for printed circuits.
67 GB / T 4723-1992 printed circuit clad phenolic paper laminate for Phenolic cellulose *** copper-clad laminated sheets for printed circuits.
68 GB / T 4724-1992 of the printed circuit copper clad epoxy paper laminates Epoxide cellulose *** copper-clad laminated sheets for printed circuits.
69 GB / T 4725-1992 printed circuit clad epoxy glass cloth laminated board Epoxide woven glass fabric copper-clad laminated sheets for printed circuits.
70 GB / T Phosphors for color picture tube phosphor Y22-G3 Phosphor Phosphors for color picture tubes is use – of Phosphor Y22-G3 < br />
71 GB / T 4779.2-1984 color CRT phosphor Y22-B2 Phosphor Phosphors for color picture tubes is use – of Phosphor Y22-B2
72 GB / T 4779.3 -1984 Color CRT phosphor phosphor Y22-R4 Phosphors for color picture tubes is use – of Phosphor Y22-R4,
73 GB / T 4825.1-1984 conductors on printed boards partial discharge test method Test method for the partial discharge of conductors on printed boards
74 GB / T 4825.2-1984 conductors on printed boards carrying capacity test method Test method for current carrying capacity of conductors on printed boards
75 GB / T 4874-1985 DC fixed metallized paper capacitor regulate the Generic specification for fixed metallized *** dielectric capacitors for direct current
76 GB / T 5076-1985 having two axial really a cylindrical component size measurement Measurement, Maximum case dimensions Maximum dimensions of the dimensions of a cylindrical component having two axial terminations
77 GB of / T 5077-1985 capacitors and resistors for capacitors and resistors
78 GB / T 5078-1985 of capacitors and resistors with unidirectional leads to the determination of the space required Method for the determination of the space required by capacitors and resistors with unidirectional terminations
79 GB / T 5489-1985 printed circuit board mapping Printed board the drawing
80 GB / T 5594.1-1985 structural ceramics for electronic components material properties testing methods tightness test methods Test methods for properties of structure ceramic used in electronic components – Test method for gas-tightness
81 GB / T 5594.2-1985 structural ceramics for electronic components material properties testing methods Young modulus shuoshi.china-b.com Poisson ratio test methods Test methods for properties of structure ceramic used in electronic components – Test method for Youngs elastic the modulus and Poisson ratio
82 GB / T 5594.3-1985 electronic component structure of ceramic materials performance uniform test method for coefficient of linear expansion test method the Test methods for properties of structure ceramic used in electronic components – Test method for the mean coefficient of linear expansion
83 GB / T 5594.4-1985 electronic components – ceramic materials for structural Methods for measuring performance dielectric loss tangent value of the test methods Test methods for properties of structure ceramic used in electronic components – Test method for dielectric loss angle tangent the value
84 GB / T 5594.5-1985 electronic components Methods for measuring performance of structural ceramic material volume resistivity test methods Test methods for properties of structure ceramic used in electronic components – Test method for volume resistivity
85 GB / T 5594.6-1985 electronic components structure of ceramic materials Methods for measuring performance chemical stability test methods Test methods for properties of structure ceramic used in electronic components – Test method for the chemical durability
86 GB / T 5594.7-1985 electronic components structure of ceramic materials performance test methods liquid permeability determination method Test methods for properties of structure ceramic used in electronic components – Test method for the microscopic structure of the liquid membrane permeability
87 GB / T used in electronic components structural ceramic materials testing methods Determination of the Test methods for properties of structure ceramic used in electronic components – Determination of the microstructure of
88 GB / T 5598-1985 beryllium oxide ceramic thermal conductivity determination method Test method for the thermal conductivity of beryllium oxide, ceramics < br />
89 GB / T 5729-1994 electronic devices with a fixed resistor Part 1: General specification for the Fixed resistors for use in electronic equipment – Part 1: Generic specification
90 GB / Fixed resistors for use in T 5730-1985 electronic equipment – Part II: Sectional specification: Fixed low power non-wire wound fixed resistor (for certification) the Fixed resistors for use in electronic equipment – Part 2: Sectional specification: Fixed low-power nonwire wound resistors
91 GB / T 5731-1985 electronic devices with a fixed resistor, Part II: vacancy specification: low-power non-wire wound fixed resistor to assess the level of E (for certification) the Fixed resistors for use in electronic equipment – Part 2: Blank detail specification: the Fixed low-power non-wirewound resistors – Assessment level E
92 GB / T 5732-1985 electronic devices with a fixed resistor four parts: Sectional specification: Fixed power resistors (for certification) the Fixed resistors for use in electronic equipment – Part 4: Sectional specification: the Fixed power resistors
93 GB / T 5733-1985 electronic equipment Part 4: Fixed resistors for use vacant concrete specification: power fixed resistors – Assessment level E (for certification) the Fixed resistors for use in electronic equipment – Part 4: Blank the detail specification: Fixed power resistors Assessment level E
94 GB / T 5734-1985 electronic devices with a fixed resistor Part 5: Sectional specification: Fixed precision resistors (for certification to use) the Fixed resistors for use in electronic equipment – Part 5: sectional specification: Fixed precision resistors
95 GB / T 5735-1985 electronic devices with a fixed resistor Part V: vacancy specification: Fixed precision resistors – Assessment level E (for certification to use) the Fixed resistors for use in electronic equipment – Part 5: Blank detail specification: Fixed precision resistors – Assessment level E
96 GB / T 5838-1986 phosphor terminology Terms for phosphors
97 GB / T 5966-1996 Electronic Equipment Fixed capacitors for use in Part 8: Sectional specification: Class 1 ceramic dielectric fixed capacitors Fixed capacitors for use in electronic equipment – Part 8: Sectional specification: the Fixed capacitors of ceramic dielectric, class 1
98 GB / T 5967-1996 Electronic Equipment Fixed capacitors for use in Part 8: vacancy specification Class 1 ceramic dielectric capacitors – Assessment level E, the Fixed capacitors for use in electronic equipment – Part 8: Blank detail specification Fixed capacitors of ceramic dielectric, class 1 – Assessment level E
99 GB / T 5968-1996 electronic devices with a fixed capacitor Part 9: Sectional specification-class ceramic dielectric fixed capacitors for the Fixed capacitors for use in electronic equipment – Part 9: Sectional specification the Fixed capacitors of ceramic dielectric, class 2
100 GB / T 5969-1996 electronic equipment – Part 9: Fixed capacitors for use in the vacancy specification Class 2 ceramic capacitors Assessment level E the Fixed capacitors for use in electronic equipment – Part 9: Blank, the detail specification, the Fixed capacitor of ceramic dielectric, class 2 – Assessment level E
101 GB / T 5993-1986 electronic devices with a fixed Capacitors Part 4: Sectional specification solid and non-solid electrolyte aluminum capacitors (for certification) the Fixed capacitors for use in electronic equipment – Part 4: Sectional specification – Aluminium electrolytic capacitors with solid and non-solid electrolyte
102 GB / T 5994-1986 electronic equipment Part IV: Job specification non-solid electrolyte aluminum capacitors Fixed capacitors – Assessment level E (for certification) the Fixed capacitors for use in electronic equipment – Part 4: Blank, the detail specification – Aluminium electrolytic capacitors with a non-solid electrolyte – Assessment level E
103 GB / T 6252-1986 Electronic Equipment Class A variable tuning capacitors Type specification of the Type specification for variable tuning capacitors- -Type A Class B fine-tune the variable capacitor type specification in electronic equipments
104 GB of / T 6253-1986 Electronic Equipment Type specification for variable trimmer capacitors – Type B in the electronic equipments
< br /> 105 GB / T 6254-1986 electronic equipment Class C preset variable capacitor type specification the Type specification for variable preset capacitors – Type C in electronic equipments
106 GB / T 6346-1986 Fixed capacitors for use in electronic equipment Part 11: Sectional specification: metal foil polyethylene terephthalate film dielectric dc capacitors (for certification) the Fixed capacitors for use in electronic equipment – Part 11: Sectional specification : the Fixed polyethylene-terephthalate film dielectric metal foil DCcapacitors
107 GB / T 6347-1986 electronic equipment Part 11: Fixed capacitors for use in the vacancy specific norms: metal foil polyethylene terephthalate ester film dielectric DC capacitors – Assessment level E (for certification) the Fixed capacitors for use in electronic equipment – Part 11: Blank, the detail specification: Fixed polyethylene-terephthalate film dielectric metal foil dc capacitors – Assessment level E
108 GB / T 6429-1986 quartz resonator model naming rule of the type designation is for the quartz crystal units
109 GB / T 6430-1986 crystal box type designation of The the rule of the type designation is for the crystal holders (enclosures,)
110 GB / T 6452-1986 inspiratory zirconium alloy powder Zirconium-Aluminium alloy powders for getters
111 GB / T 6453 -1986 getter zirconium alloy composite strip Zirconium-Aluminium alloy combined strips for the getters
112 GB / T 6454-1986 inspiratory zirconium aluminum alloy ring and on-chip Rings and tablets of zirconium -aluminum alloy for the getters
113 GB / T 6455-1986 release mercury inspiratory using composite strip Mercury releasing combined strips for getters
114 GB / T 6591-1986 Electronic equipment with capacitors and resistors term term Terms of capacitor and resistor for electronic equipment
115 GB of / T 6625-1986 doped nitrogen getter nitrogen content of the test methods Test methods for nitrogen content of nitrogen-doped the getters
116 GB / T 6626.1-1986 release mercury getter performance testing methods release mercury getter release mercury characteristics of test methods Test methods for the characteristics of getter-mercury dispenser – Test methods for mercury The yield characteristic of getters-mercury dispensers
117 GB / T 6626.2-1986 release mercury performance test method of the getter release mercury getter mercury content of the test methods Test methods for the characteristics of the getter- mercury dispensers – Test method for mercury content of getters-mercury dispensers
118 GB / T 6626.3-1986 release mercury getter performance test method for release of mercury getter outgassing test methods Test methods for the characteristics of getter-mercury dispensers – Test method for gas emission of mercury dispensers getters
121 GB / T 6626.4-1986 release mercury getter performance test methods to release mercury getter powder pressing firmly Test method for the Test methods for the characteristics of getter-mercury dispensers – Method for peel off test, of getters-mercury dispensers
120 GB / T 6627-1986 man-made quartz crystal rod model naming method Designations for lumbered synthetic quartz crystals
121 GB / T 6643-1986 General purpose rigid coaxial transmission line and its flange connector specification General purpose rigid coaxial transmission lines and their associated flange connectors – Generic specification
122 GB / T 6663-1986 directly heated negative temperature coefficient thermistor specification (for certification) General specification for the directly heated negative temperature coefficient thermistors 123 GB / T 6664-1986 Direct Thermal specification – Assessment level E (for certification) Blank, the detail specification for directly heated negative temperature coefficient thermistors – Assessment level E
124 GB / T 6832-1986 head of the negative temperature coefficient thermistor vacancies Methods, wearing headphones measurement methods of measurement on headphones
125 GB / T 7016-1986 fixed-resistor current noise measurement method Method of measurement of current noise generated in The fixed resistors
126 GB / T 7017-1986 resistor nonlinear measurement method Method of measurement of non-linearity in resistors
127 GB / T 7153-1987 direct thermal step positive temperature coefficient of thermal resistance Generic specification (for certification) the Generic specification for the directly heated a positive step-function temperature coefficient thermistors
128 GB / T 7154-1987 direct thermal step positive temperature coefficient thermistor vacancies specific specification – Assessment level E (for certification) Blank, the detail specification for the directly heated positive step-function temperature coefficient thermistors – Assessement level E
129 GB of / T 7213-1987 electronic device with a fixed capacitor Part 15: Sectional specification for non-solid or solid electrolyte tantalum capacitors (for certification) the Fixed capacitors for use in electronic equipment – Part 15: Sectional specification – Fixed tantalum capacitors with non-solid or solid electrolyte
130 GB / T 7214-1987 Electronic Equipment Fixed capacitors for use in Part 15: vacancy specification with solid electrolyte and porous anode tantalum capacitors – Assessment level E (for certification to use) the Fixed capacitors for use in electronic equipment – Part 15: Blank, the detail specification – Fixed tantalum capacitors with solid electrolyte and porous anode – Assessment level E
131 GB / T 7265.1-1987 solid dielectric microwave complex permittivity of the test method perturbation method the Test method for complex, permittivity of solid dielectric materials at the microwave frequencies – Perturbation method
132 GB / T 7265.2-1987 solid dielectric microwave complex permittivity of test methods “open cavity” method Test method for the complex, permittivity of solid dielectric materials at microwave frequencies – Open cavity from “method
133 GB / T 7332-1996 Electronic equipment Fixed capacitors for use in Part 2: Sectional specification: Fixed metallized polyethylene-terephthalate dimethyl ester film dielectric dc capacitors Fixed capacitors for use in electronic equipment – Part 2: Sectional specification – Fixed metallized polyethylene-terephthalate film dielectric dccapacitors
134 GB of / T 7333-1996 electronic equipment Part 2: Fixed capacitors for use in the vacancy specific specification – Fixed metallized polyethylene terephthalate film dielectric DC capacitors – Assessment level E, the Fixed capacitors for use in electronic equipment – Part 2: Blank, the detail specification – Fixed metallized polyethylene-terephthalate film the dielectric dccapacitors – Assessment level E
135 GB / T 7338-1996 electronic equipment Fixed resistor networks with a fixed resistor Part 6: Specification of each resistor can be used alone measure the Fixed resistors for use in electronic equipment – Part 6: Sectional specification – Fixed resistor networks with individually measurable resistors
136 GB / T 7339-1987 electronic devices with a fixed resistor Part VI: Job specification: Resistance and the same power, each resistor individually measured fixed resistor networks – Assessment level E (for certification) the Fixed resistors for use in electronic equipment – Part 6: Blank the detail specification – the Fixed resistor networks with individually measurable resistors, all of equalvalue and equal dissipation – Assessment level E
137 GB / T 7340-1987 electronic devices with a fixed resistor Part VI: Job specification: resistance and power consumption of each resistor can be used alone measuring a fixed resistor network (for certification) the Fixed resistors for use in electronic equipment – Part 6: Blank, the detail specification – Fixed resistor networks with individually measurable resistor of either different resistance values ??or different rated dissipations – Assessment – Assessment level E level E
138 GB / T 7345-1994 control micro-motor basic technology requirements of the General requirements for electrical a micro machine for automatic control system
139 GB / T 7423.1-1987 Semiconductor Devices radiator General technical conditions of the Heat the sink of semiconductor devices – Generic specification
140 GB / T 7423.2-1987 Semiconductor Devices Radiator Heat Sinks Heat the sink devices of smiconductor – the Heat the sink, extruded shapes
141 of GB / T 7423.3-1987 semiconductor devices radiator interdigital radiator Heat the sink of the semiconductor devices – Heat the sink, Staggered fingers shapes
142 GB / T 7556-1987 requirements of the symmetrical cable 60 channel carrier system into the *** General characteristics complying with the network performance objectives for 60-channel carrier telephone systems on symmetric cable pairs
143 GB / T 7557-1987 1.2/4.4mm standard requirements of the coaxial cable 300-channel carrier system into the *** General characteristics complying with the network performance objectives for the 300-channel carrier telephone systems on standardized 1.2/4.4mm coaxial cable pairs
144 GB of / T 7613.1- 1987 conductors on printed boards resistant to current test methods Test method for current proof of conductors on printed boards
145 GB / T 7613.2-1987 printed circuit board surface withstanding voltage test methods Test methods for voltage proof of the su * ** ce the layers on printed boards
146 GB / T 7613.3-1987 printed circuit board through holes resistant to current test methods Test methods for current proof of plated-through holes on printed boards
< br /> 147 GB / T 7614-1987 calibration of earphones with the wideband artificial ear An artificial ear of wide band type for the calibration of earphones used in audiometry
148 GB / T 8553-1987 crystal, general specification Holders (Enclosures), the crystal, general specification for
149 GB / T 8977-1988 FM, Software Engineering Masters television broadcast receivers with 300Ω/75Ω balanced – unbalanced impedance transformer 300Ω / 75Ω balun is for the FM and TV broadcast receiver
150 GB / T 9020-1988 video coaxial connector specification Visual-frequency – Coaxial connectors, the generic specification of
serving Master Master Master of Fine Arts, Master of Economics
[] 2012 15 Daikin shares
Show Name] Japan International Electronics Show
【Venue】 Japan Tokyo Big Sight International Exhibition Centre (TOKYOBIGSIGHT)
Japan International Electronics Show (NEPCONJAPAN) by Reed Exhibitions group of Japanese organized is one of the world-famous electronics exhibition. Since its inception, the annual session will be held the 39th in 2010. Exhibits continue to refine, has been the formation of the seven blocks of the design and manufacture of production equipment and R
